Semiconductor Industry


   

Absolute Pressure Regulator

Series AP 1100

click on image to enlarge

Features:
  • Single stage
  • Hastelloy® alloy C-22® or SS 316L VAR secondary remelt construction
  • 15 µin. Ra max surface finish (10, 7 and 5 µin. opt)
  • Only one nonmetallic seal (PCTFE) in the process stream
  • Cleaned, assembled and packaged for high purity semiconductor applications
  • Flow rate to 500 sccm
  • Vacuum to 300 psig (21 bar) inlet, 100 torr to 10 psig (.7 bar) outlet
Operating Parameters:
Source pressurevacuum to 300 psig (21 bar)
Delivery pressure      AP 1101100 mm Hg absolute to 10 psig
Proof pressure500 psig (34 bar)
Burst pressure8,000 psig (552 bar)

Other Parameters:
Inlet/outlet connectors1/4 or 3/8 inch face seal or tube weld
Bonnet port1/8 inch NPT
Flow coefficient(Cv) 0.05
Internal volume0.49 in3 (8 cm3)
Operating temperature-40° to +160°F (-40° to +71°C)
Surface finish15 µin. (0.4 µm) Ra max standard;
10 µin (0.25 µm); 7 µin (0.18 µm); and 5 µin (0.13 µm) optional
Inboard leakage2 x 10-10 sccs
Outboard leakage2 x 10-9 sccs He at 300 psig inlet pressure
Leakage across seat4 x 10-8 sccs He at 300 psig inlet pressure
Installationsurface or panel (optional)


© 2012 AFT B.V.
DisclaimerImprintSitemap