Semiconductor Industry


   

Two-Stage, Positive Shut-off AP 1700

Series AP 1700
Series AP 1700

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Features:
  • Regulator of choice for B2H6 cylinder applications
  • SS 316L VAR secondary remelt construction
  • 15 µin. surface finish (10, 7 and 5 µin. opt)
  • Vacuum to 3,500 psig (241 bar) inlet
  • Cleaned, assembled and packaged for high purity semiconductor applications
  • Two stage pressure reduction eliminates supply pressure effect
Operating Parameters:
Source pressurevacuum to 3,500 psig (241 bar)
Delivery pressure   AP 17021 to 30 psig (0.07 to 2 bar)
AP 1706
2 to 60 psig (0.14 to 4 bar)
AP 1710
2 to 100 psig (0.14 to 7 bar)
First stage pressure175 psig (12 bar) nominal
Proof pressure4,000 psig (276 bar)
Burst pressure8,000 psig (552 bar)

Other Parameters:
Inlet/outlet connectors1/4 or 3/8 inch face seal or tube weld
Bonnet port1/8 inch NPT
Flow coefficient(Cv) 0.05
Internal volume0.92 in3 (15.1 cm3)
Operating temperature-40° to +160°F (-40° to +71°C)
Surface finish15 µin. (0.4 µm) Ra max standard;
10 µin (0.25 µm); 7 µin (0.18 µm); and 5 µin (0.13 µm) optional
Inboard leakage2 x 10-10 sccs
Outboard leakage2 x 10-9 sccs He at 1,500 psig inlet pressure
Leakage across seat4 x 10-8 sccs He at 1,000 psig inlet pressure
Installationsurface or panel (optional)
Delivery pressure rise0.05 psig per 100 psig source pressure drop



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