Semiconductor Industry


   

Manual Springless Diaphragm Valve

Series AP 3600
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Features:
  • Stainless steel 316L VAR secondary remelt or Hastelloy® alloy C-22® construction
  • 15 µin. surface finish (10, 7 and 5 µin. optional)
  • Metal to metal seal to atmosphere
  • Replaceable PCTFE seat (Vespel® optional)
  • Vacuum to 3,000 psig (207 bar) AP 3600
  • Vacuum to 250 psig (17 bar) AP 4600
  • Cleaned, assembled and packaged for high purity semiconductor applications
  • Internal stop prevents overstressing seat
Operating Parameters - all valves:
Inlet pressure                   AP 3600vacuum to 3,000 psig (207 bar)
AP 4600
vacuum to 250 psig (17 bar)
Outlet pressurevacuum to inlet pressure
Proof pressure4,000 psig (276 bar)
Burst pressure8,000 psig (552 bar)

Other Parameters - all valves:
Inlet/outlet connectors1/4 or 3/8 inch face seal or tube weld
Flow coefficient (Cv)        AP 36000.29, XT = 0.6
AP 4600
0.5, XT = 0.6
Internal volume0.06 in3 (1.07 cm3)
Operating temperature-40° to +160°F (-40° to +71°C)
Surface finish15 µin. (0.4 µm) Ra max standard;
10 µin (0.25 µm); 7 µin (0.18 µm); and 5 µin (0.13 µm) optional
Inboard leakage2 x 10-10 sccs
Outboard leakage2 x 10-9 sccs He at 250 psig
Leakage across seat4 x 10-8 sccs He at 250 psig inlet pressure



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